Epoxy resin, Bisphenol A

Epoxy resin, Bisphenol A
Art.No E-002
Formula
Conc (% w/w) 1.0% pet
Series SH, SS, IS, PB, GB, FIN, DMP, NA, S, INS, BS, ICB, PST, ABS, NAC, LA, SB, CB, INF, SIDAPA, ECB, AC, NZBS
Molality -
MW 370
CAS
Hapten Information

Uses:

Resin, based on epichlorhydrin and bisphenol A for use in adhesives, surface coatings, electrical insulation, plasticizers, polymer stabilizers, laminates, surface coatings, paints and inks, product finishers, PVC products, vinyl gloves, etc. Also in the building industry, electron microscopy, and sculpture. Oligomers may vary in molecular weight from 340 and higher. The higher the molecular weight, the less sensitizing the compound. May produce erythema multiforme like eruptions. ABCD. ICU.