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Epoxy resin, Bisphenol A

Art.No E-002
Formula
Conc (% w/w) 1.0% pet
Series SH, SS, IS, PB, GB, FIN, NA, DMP, S, INS, BS, ICB, POL, ABS, NAE, NAC, LA, SB, CB, INF, SIDAPA, ECB, PCB
Molality -
MW 370
CAS
SDS
Download Safety Data Sheet
Hapten Information
Download Hapten information

Synonyms:

Epoxy resin; Phenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane; Bisphenol A, (chloromethyl)oxirane polymer; Bisphenol A, epichlorohydrin polymer; (Chloromethyl)oxirane, 4,4'-(1-methylethylidene)bisphenol copolymer; Epikote 827, Der 331; Epon 1009; Phenol,4,4'-(1-methylethylidine)bis-,polymer with(chloromethyl)oxirane; 4,4'-Isopropylidenediphenol, polymer with 1-chloro-2,3-epoxypropane; Araldite 506.

Uses:

Resin, based on epichlorhydrin and bisphenol A for use in adhesives, surface coatings, electrical insulation, plasticizers, polymer stabilizers, laminates, surface coatings, paints and inks, product finishers, PVC products, vinyl gloves, etc. Also in the building industry, electron microscopy, and sculpture. Oligomers may vary in molecular weight from 340 and higher. The higher the molecular weight, the less sensitizing the compound. May produce erythema multiforme like eruptions. ABCD. ICU.

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